Rigid-Flex Capability
Welcome to our Rigid-Flex PCB Capabilities section. Here, we present our expertise in Rigid-Flex PCB, which combine the benefits of rigid and flexible technologies for enhanced versatility and durability.
In this section, you'll find a detailed table outlining our production capabilities, including key specifications and features. Our advanced manufacturing processes ensure high performance and reliability, catering to diverse applications from electronics to aerospace and automotive. Review the information below to see how our Rigid-Flex PCB capabilities can support your projects.
| Rigid-flex PCB Technical Capabilities | |
| ITEM | Standard Capabilities |
| Flex-Rigid PCB Layer | 2-20L |
| Rigid-flex PCB Material | |
| Base Material | PI (12.5um, 25um, 50um, 100um) |
| FR4 TG 130, 150, 170, 180 (0.05mm-3.2mm) | |
| Stiffeners | PI Stiffener: 12.5/25/50/75/100/125/150/200/250 (um) |
| FR4 Stiffener: 0.1mm-2.0mm | |
| SUS Stiffener: 0.1mm-0.5mm | |
| Aluminum Stiffener: 0.1mm-0.5mm | |
| EMI shielding film | TSS100, TSS200, HCF-6000G, PC800, etc. |
| Board Size & Thickness | |
| Biggest Board Size | 500mm*500mm |
| Board Thickness | 0.25mm-5.0mm |
| Thickness Tolerance | 0.25mm～1mm: ±0.1mm |
| 1mm～5mm: ±10% | |
| Drill | |
| Minimum Hole Size | 0.1 mm |
| Holes Size Tolerance | ±0.03 mm |
| Holes Posistion Tolerance | ±0.05 mm |
| Minimum vias Pad Size | 0.3mm |
| Minimum Annular Ring Size | 0.1mm |
| Blind/Buried Vias | Yes |
| Copper Tracks and Plating | |
| Minimum Track Width/Space | 0.1mm/0.1mm |
| Track Width Tolerance | 20% |
| Tracks/Pads Position Tolerance | ≥0.06 mm |
| Tracks/Pads To Board Edge | ≥0.15 mm |
| Golden Finger Pitch Tolerance | Pitch:10~20mm : ± 0.03mm |
| Pitch:20~50mm : ± 0.05mm | |
| Copper Plating Thickness | 20-35um |
| Hole Copper Thickness | 20-35um |
| Surface Finish | |
| ENIG | AU: 1-3u" Thickness |
| NI: 40-120u" Thickness | |
| Hard Gold Plating | AU: 1-50u” Thickness |
| NI: 80-320u" Thickness | |
| Immersion Silver | Ag: 6-12u" Thickness |
| OSP | 8-16u" Thickness |
| Immersion Tin | SN: 10-60u" Thickness |
| Tin Plating | SN: 5-30um Thickness |
| ENEPIG | Au：1-4u" Thickness |
| NI: 120-200u" Thickness | |
| Pd：1-6u" Thickness | |
| Coverlay | |
| Coverlay Opening Size Tolerance | ±0.1 mm |
| Minimum Drilling Size on Coverlay Opening | 0.45mm |
| Minimum Square Size on Coverlay Opening | 0.5mm*0.5mm |
| Coverlay Opening Position Tolerance | ±0.1 mm |
| Coverlay Align Tolerance | ±0.1 mm |
| Excessive Glue | ≤0.15 mm |
| Minimum Area of Excessive Glue | ≤20% Pads Area |
| Solder Mask and Silkscreen | |
| Solder Mask Thickness | 15um +/-5um |
| Solder Mask Tolerance For Opening Size | +/-0.05mm |
| Solder Mask Tolerance For Opening Position | 0.1mm |
| Minimum Silkscreen line width | 0.13mm |
| Minimum Silkscreen Gap | 0.2mm |
| Minimum Silkscreen Position Tolerance | +/-0.3mm |
| Minimum Silkscreen height | 0.8mm |
| Minimum Solder Mask Bridge | 0.13mm |
| Board Outline & Stiffeners | |
| Board Outline Tolerance with Steel Die | ±0.1 mm |
| Board Outline Tolerance with Knife Die | ±0.2 mm |
| Minimum Gap Between Drilling and Board Edge | ≥0.5 mm |
| PSA Position Tolerance | ±0.2 mm |
| Stiffeners Position Tolerance | ±0.2 mm |
| FPC E-Test | |
| Test Voltage | 10-50V |
| Insulation Test Impedance | ≥10MΩ |
| Conduction Test Impedance | ≤50Ω |
| Impedance Tolerance | 10% |
| FPC Physical Property | |
| Solderability Test | 245±5℃, 3 Seconds For One Time,soldering Area≥95% |
| Thermal Shock Test | 288±5℃, 10 Seconds Per 3 Times,no Delamination and No Bubbles |
| FCCL Peel Strength | ≥0.8kgf/㎠ (1cm width sample) |
| Coverlay Peel Strength | ≥0.8kgf/㎠ (1cm width sample) |
| Stiffeners Peel Strength | 0.15 N/mm (Hot-Press Adhesive) |
| 0.49 N/mm (PSA Adhesive) | |
Let’s talk! We’ll provide the perfect solution for you!
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Huaruixin Electronics mainly produces printed circuit boards as the core business, to provide customers with one-stop solutions for FPC/PCB production, components sourcing and Assembly. - WHAT WE DO — PCB Design Solutions — Flex PCB Production — Components Sourcing — FPC&PCB Assembly
- PRODUCTS — Single Sided Flexible Circuits — Double Sided Flexible Circuits — Multilayer Flexible Cirucits — Rigid-Flex Circuits — FPC Assembly — PCB Assembly
- CAPABILITY — FPC Capability — Rigid-Flex Capability — PCB Capability — Assembly Capability
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