Product Description:
Our FPC (Flexible Printed Circuit) for smart insoles is meticulously designed to meet the specific needs of advanced wearable technology integrated into footwear. These flexible circuits are essential for providing real-time data collection, comfort, and durability, making them ideal for smart insoles that monitor health metrics and enhance user experience.
Key Features:
•High Sensitivity and Precision: Engineered to support sensitive sensors and accurate data collection, our FPCs ensure precise measurement of parameters such as pressure, gait, and temperature. This is critical for providing detailed feedback and insights on foot health and activity.
•Flexible and Contour-Adapting: Designed to conform to the complex curves and movements of the foot, our FPCs maintain functionality and performance while being comfortably integrated into the shoe's insole. This flexibility ensures that the smart insoles remain comfortable and unobtrusive during wear.
•Durability and Environmental Resistance: Built to withstand the rigors of daily wear, including exposure to moisture, varying temperatures, and physical stress, our FPCs offer long-lasting performance. This durability is essential for maintaining reliable operation and accuracy in diverse environments.
Applications:
•Health Monitoring: Ideal for smart insoles that track foot health metrics such as pressure distribution, gait analysis, and temperature regulation, providing valuable data for medical and fitness applications.
•Sports and Fitness: Perfect for athletic insoles that monitor performance metrics and provide feedback to enhance training and prevent injuries.
•Diabetic Care: Suitable for insoles designed to detect early signs of foot conditions, offering critical insights for individuals with diabetes or other foot-related health concerns.
•Daily Comfort and Support: Enhances everyday footwear with smart technology that adjusts to individual needs, improving overall comfort and support through continuous monitoring.
Double Sided FPC Structure Reference (Specifications Optional):
2L FPC with Adhesive material | ||
PI (12.5/25/50/100um, etc.) | Coverlay | |
AD (15/25/35/50um, etc.) | ||
Copper (6/9/12/18/35/70/100um, etc.) | Base Material | |
AD (0/12.5/20/25um, etc.) | ||
PI (12.5/25/50/100um, etc.) | ||
AD (0/12.5/20/25um, etc.) | ||
Copper (6/9/12/18/35/70/100um, etc.) | ||
AD (15/25/35/50um, etc.) | Coverlay | |
PI (12.5/25/50/100um, etc.) |
2L FPC with Adhesiveless material | ||
PI (12.5/25/50/100um, etc.) | Coverlay | |
AD (15/25/35/50um, etc.) | ||
Copper (6/9/12/18/35/70/100um, etc.) | Base Material | |
PI (12.5/25/50/100um, etc.) | ||
Copper (6/9/12/18/35/70/100um, etc.) | ||
AD (15/25/35/50um, etc.) | Coverlay | |
PI (12.5/25/50/100um, etc.) |
This introduction emphasizes the specialized features of FPCs for smart insoles, focusing on their sensitivity, flexibility, durability, and efficient power management. It also highlights their specific applications in health monitoring, sports, diabetic care, and daily comfort, showcasing how they meet the unique requirements of advanced wearable technology in footwear.
Let’s talk! We’ll provide the perfect solution for you!
-
Huaruixin Electronics mainly produces printed circuit boards as the core business, to provide customers with one-stop solutions for FPC/PCB production, components sourcing and Assembly.
- WHAT WE DO — PCB Design Solutions — Flex PCB Production — Components Sourcing — FPC&PCB Assembly
- PRODUCTS — Single Sided Flexible Circuits — Double Sided Flexible Circuits — Multilayer Flexible Cirucits — Rigid-Flex Circuits — FPC Assembly — PCB Assembly
- CAPABILITY — FPC Capability — Rigid-Flex Capability — PCB Capability — Assembly Capability
- Copyright © 2024 Shenzhen Huaruixin Electronics Co., Ltd. All Rights Reserved.
- Design By BONTOP